Price: $128.00 - $84.03
(as of Feb 12, 2025 07:29:15 UTC – Details)
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Publisher : World Scientific Pub Co Inc (January 1, 2014)
Language : English
Hardcover : 354 pages
ISBN-10 : 9814508594
ISBN-13 : 978-9814508599
Item Weight : 1.5 pounds
Dimensions : 6 x 1 x 9 inches